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1709 results:
Industrial Quality Control   Industrial Quality Control with Fast Terahertz Systems Plastics, paper, ceramics, … are transparent in the THz range Terahertz techniques enable 100% inspection in production lines Ultrafast  
THG Microscopy  
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Ultrafast Fiber Lasers for THG Microscopy Third Harmonic Generation (THG) microscopy makes use of non-fluorescent samples by the combination of the advantages of label-free imaging with restriction  
smart Series   Optimized lasers for OEM integration Compact, cost-effective and robust design Established concept since 2007 Proven industry standards In 2007 TOPTICA introduced their iBeam smart diode  
Allgemeine_Einkaufsbedingungen_Stand_20230731_DE.pdf   TOPTICA PHOTONICS AG ALLGEMEINE EINKAUFSBEDINGUNGEN 1. Geltungsbereich und maßgebliche Bedingungen 1.1. Die vorliegenden Allgemeinen Einkaufsbedingungen („AEB“) gelten für alle  
terms of sale - english   terms of sale - english terms of sale - english terms of sale - english terms of sale - english terms of sale - english terms of sale - english terms of sale - english terms of sale - english terms  
Terahertz Sources   Terahertz Sources Optoelectronic systems: High bandwidth, high speed Ideal for spectroscopy or non-destructive testing Pulsed terahertz: Fast measurements, broad spectrum cw terahertz:  
cw Terahertz   cw Terahertz Optical heterodyning in semiconductor photomixers Up to 3 THz bandwidth, up to 100 dB dynamic range Tunable DFB diode lasers + GaAs or InGaAs photomixers Optional:  
Pulsed Terahertz   Pulsed Terahertz Photoconductive switches generate pulsed terahertz radiation TeraFlash pro: 6 THz bandwidth, 95 dB PDR in < 20 s TeraFlash smart: 1600 pulse traces/s @ 150 ps scan length  
Computer-To-Plate   High-Performance Diode Lasers for Computer-To-Plate (CtP) Applications Computer-to-plate (CtP) is an imaging technology used in modern printing processes. In this technology, an image created in a  
Scatterometry   Highly Stable Lasers for Scatterometry In strive for ever more capable electronics, advanced processes led to an increase in complicated 3D structures (i.e. FinFET and others). To keep manufacturing  
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